EUR/USD
1.15987
-0.078%
Gold
4581.86
-0.741%
Oil
59.259
0.228%
USD/JPY
158.072
-0.341%
GBP/USD
1.33795
-0.019%
GBP/JPY
211.500
-0.349%
Real-time News
On January 17, Russian Human Rights Commissioner Moskalikova told reporters in Geneva after meeting with ICRC President Sporalitz that restarting the prisoner-of-war exchange process between Russia and Ukraine is the top priority. She stated that Russia has submitted a list of Ukrainian military personnel in Russia who are ready for repatriation. Previously, Ukraine typically submitted the list, and Russia agreed to repatriation, but the current dialogue with Ukraine is "puzzling." It is difficult to discuss the possible exchange deadline and the number of prisoners at this time, as "various details could emerge until the last minute, potentially disrupting the process or changing its direction."On January 17, Ukrainian President Volodymyr Zelenskyy stated that the Ukrainian delegation had arrived in the United States that day and was expected to receive its first briefing on the talks that evening Kyiv time. Zelenskyy said the main task of the Ukrainian delegations trip was to provide the US with comprehensive and accurate information about the current situation. Zelenskyy reiterated that Ukraine has never been, and will never be, an obstacle to peace, and that progress in the current diplomatic process depends on the positions of the partners.On January 17th, it was reported that on January 13th, according to Xian University of Electronic Science and Technology, Academician Hao Yues team at the university broke through a 20-year bottleneck in semiconductor materials technology, achieving a leap forward in chip heat dissipation efficiency and overall performance, providing a replicable Chinese paradigm for solving various high-quality integration problems of semiconductor materials. The relevant findings were recently published in the top international journals *Nature Communications* and *Science Advances*. Zhang Jincheng, Vice President and Professor of Xian University of Electronic Science and Technology, stated, "Inability to dissipate heat can lead to decreased chip performance or even device burnout." The team innovatively injected high-energy ions into the crystal of third-generation semiconductor chips, making the surface of the crystal nucleation layer smooth. This breakthrough reduced the semiconductor thermal resistance to one-third of its original value, solving the heat dissipation problem faced by third-generation and future semiconductor chips. Simultaneously, this breakthrough significantly improved the performance of semiconductor devices.According to Syrian security sources and Turkish defense sources, US-led coalition warplanes flew over northern Syria, where clashes were taking place between Syrian government forces and Kurdish militants.Musk: The Colossus 2 supercomputer is now operational. It is the worlds first gigawatt-level training cluster and will be upgraded to 1.5 gigawatts in April.
