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On June 30th, BOE Technology Group Co., Ltd. (BOE A) stated during a targeted investor survey that the company initiated research on glass-based substrate technology in 2020. In 2022, it invested 390 million yuan to build a wafer-level innovation experimental platform compatible with both glass and silicon substrates. In 2024, it invested 993 million yuan to build a board-level glass-based packaging substrate pilot line, completing the installation and commissioning of main equipment by the end of 2025, and achieving full automation of the equipment line in the first half of 2026. The pilot line has a designed capacity of 1,000 wafers per month. Currently, the company has achieved full-process integration of glass-based packaging substrates, including TGV via opening, deep via copper filling, layer addition, and wiring. It is expected to complete the development and delivery of large-size, high-layer (9-2-9, 20-layer) glass-based substrate samples by 2025. The companys target product is a glass-based substrate required for advanced packaging of large-size computing chips, compatible with different advanced packaging methods. Samples have already been delivered to some domestic customers, and some customers have passed concept certification and entered the technical testing phase. To date, the company has not yet achieved mass production, and this business has not yet generated revenue.According to Hong Kong Stock Exchange documents, Longxun Semiconductor (Hefei) Co., Ltd. has submitted a listing application to the Hong Kong Stock Exchange.On June 30th, the 2026 Annual Forum of the China Automotive Power Battery Industry Innovation Alliance and the 10th Anniversary Conference of the Alliance were successfully held in Beijing. Ma Chunsheng, Director of the Automotive Development Division of the Equipment Industry Department of the Ministry of Industry and Information Technology, stated that the next step will be to focus on the new development stage, accurately and comprehensively implement the new development philosophy, and continuously promote the high-quality development of the power battery industry by increasing efforts in key technology research, optimizing industry management policies, maintaining a healthy competitive order, and deepening international exchanges and cooperation.According to Hong Kong Stock Exchange documents, Tongao Testing Group Co., Ltd. has submitted a listing application to the Hong Kong Stock Exchange.U.S. stocks rose, with the Nasdaq up more than 1%, the S&P 500 up nearly 0.5%, and the Dow Jones up 0.18%.

The US Stock Market Continues to Pull Back

Skylar Shaw

Apr 02, 2022 11:25

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S&P 500 Technical Analysis

On Friday, the S&P 500 sought to climb in the futures markets but gave back gains, indicating weakness. As a result, the market currently threatens the 4500 level in the futures market, which has previously been a key sector. As a result, it'll be fascinating to watch whether we can pull back much farther, possibly to the 50 Day EMA.


The candlestick's magnitude isn't particularly impressive, but it appears like the 4500 goal I suggested before will be tested. If we break it down further, the 50 Day EMA, which is at the 4400 level, makes a lot of sense, followed by the 200 Day EMA, which is also at that level. 


The market is still highly loud, and I believe it will continue to be so in the future. After all, there are a slew of confusing signals at the present, not least in the bond market, where many traders anticipate we'll see as many as eight interest rate hikes, while others say it's impossible.


Find a reason to go higher, but this is due to the fact that it is unconcerned about the underlying economy. Keep in mind that stock markets are about liquidity more than anything economic. If it were the case, the latest straight-up-in-the-air photo would not have taken place. 


That said, savage rallies are common in bear markets, so, while hope springs eternal, I'll be betting on the downside through options rather than directly in the market.