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Real-time News
On June 30th, Cainiao officially launched its "Customized End-to-End Logistics Solution for Technology Going Global," providing end-to-end, customized logistics services for the global expansion of technology companies in areas such as AI computing power, intelligent manufacturing, and robotics. It is understood that Cainiao has identified AI computing power, intelligent manufacturing, high-end equipment, and robotics as key service areas for its cross-border logistics, and will continue to expand its dedicated logistics product portfolio for technology going global.On June 30th, South Korean media outlet The Bell reported on the 26th that Samsung Electronics is accelerating its development of the 1.4nm (SF1.4) process node. This advanced process was initially planned for mass production in 2027, but due to a shift in the focus of its foundry business, mass production has been postponed to 2029. The report indicates that Samsung Electronics recently shared its SF1.4 process solutions with major semiconductor equipment companies such as Applied Materials and Lam Research, hoping to achieve upstream and downstream collaboration and accelerate the development of the most suitable equipment combination for this node, including customized versions of standard equipment. Samsung Electronics has already acquired High NA EUV lithography patterning equipment from ASML, which is deployed in the NRD-K semiconductor R&D complex. For Samsung Electronics, the High NA EUV lithography machine is expected to be used in production at the SF1.4 node as early as possible.June 30 - According to data from the National Energy Administration, in May 2026, a total of 6,173 new registered new energy power generation projects (excluding household photovoltaic) were added nationwide, including 27 wind power projects, 6,136 photovoltaic power generation projects (39 centralized photovoltaic power generation projects and 6,097 industrial and commercial distributed photovoltaic power generation projects), and 10 biomass power generation projects.On June 30th, Applied Materials unveiled its product line of 3D chip manufacturing equipment for AI semiconductor applications. This series of equipment focuses on planarization, deposition, and metrology for advanced packaging processes such as high-bandwidth memory (HBM), chiplets, and hybrid bonding. Specifically, the unveiled equipment includes advanced chemical mechanical polishing (CMP), electrochemical vapor deposition (ECD), and plasma-enhanced chemical vapor deposition (PECVD) equipment for packaging, and also adds electron beam-based process control equipment and upgrades its epitaxial equipment for DRAM processes.June 30 – A survey shows that New Zealand businesses confidence in the economic outlook has improved, mainly driven by signs of reconciliation between the US and Iran and lower fuel prices. ANZ Banks New Zealand branch said on Tuesday that its business confidence index rose to 36.6 in June from 10 in May, the highest level since February, and well above Aprils -10.6. The indicator measuring businesses operating capacity also rose to 36.9 from 25.6. This improved business confidence further suggests that economic growth this year may not slow as much as initially expected. "Despite the continued uncertainty, businesses seem more optimistic about the future and are more willing to invest and hire," said Sharon Zolner, ANZ Banks chief economist for New Zealand. "This months survey suggests that businesses and the overall economy are on track to recover to some extent to pre-oil price levels."
