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Real-time News
On January 17th, it was reported that on January 13th, according to Xian University of Electronic Science and Technology, Academician Hao Yues team at the university broke through a 20-year bottleneck in semiconductor materials technology, achieving a leap forward in chip heat dissipation efficiency and overall performance, providing a replicable Chinese paradigm for solving various high-quality integration problems of semiconductor materials. The relevant findings were recently published in the top international journals *Nature Communications* and *Science Advances*. Zhang Jincheng, Vice President and Professor of Xian University of Electronic Science and Technology, stated, "Inability to dissipate heat can lead to decreased chip performance or even device burnout." The team innovatively injected high-energy ions into the crystal of third-generation semiconductor chips, making the surface of the crystal nucleation layer smooth. This breakthrough reduced the semiconductor thermal resistance to one-third of its original value, solving the heat dissipation problem faced by third-generation and future semiconductor chips. Simultaneously, this breakthrough significantly improved the performance of semiconductor devices.According to Syrian security sources and Turkish defense sources, US-led coalition warplanes flew over northern Syria, where clashes were taking place between Syrian government forces and Kurdish militants.Musk: The Colossus 2 supercomputer is now operational. It is the worlds first gigawatt-level training cluster and will be upgraded to 1.5 gigawatts in April.The Syrian army says it has seized two oil fields from Kurdish factions in northern Syria.Musk: Our AI5 chip design is nearing completion, while AI6 is still in its early stages.
